Precision CCD visual laser solder ball bonding SPL-LR21

Description

Parameter configuration

Model SPL-LR21
Outline Dimensions (mm) 850*950*1650
Rated Voltage AC220V
Maximum Current 25A
Rated Power 3.5KW
Compressed Air (MPa) 0.7MPa
Nitrogen (MPa) 0.5MPa 99.99%~99.999%
Laser Power 60~150W(915nm)/200W(1070nm)
Laser Wavelength (nm) 615/1070
Working Range (mm) 200*200

Main Features:

  • Soldering method: High-efficiency laser welding, which is a non-contact welding process that eliminates external forces such as static electricity and friction;
  • Welding space: Capable of completing welding in tight spaces and performing three-dimensional welding; (Minimum solder pad size: 0.2mm; solder pad spacing: 0.25mm)
  • Motion system: Imported servo motors and high-precision components are used, ensuring superior accuracy and industry leadership, with precise positioning to 0.02mm;
  • Structural system: It adopts an integrated marble gantry platform architecture, which is resistant to deformation and ensures better precision stability during prolonged equipment use; components such as the motion mechanism, measurement mechanism, welding unit, standard machine platform, load & unload, and fixed-position track are non-standard;
  • Welding single-point speed: 3 balls/second, yield rate: over 99.6%;
  • Connector: Equipped with a built-in cleaning system, with adjustable position and three-axis adjustment, ensuring precision and saving time and effort.