DIP Post-wave AOI inspection – Top/Bottom Dual View SPL-DI511
Product Introduction:
This SPL‑DI511 is a top‑bottom dual‑view AOI machine specially developed for DIP post‑wave‑soldering processes. The machine integrates high‑resolution top‑side and bottom‑side vision cameras, enabling synchronous inspection of component mounting status on PCB top‑side and solder joint quality on PCB bottom‑side. Built‑in large touch‑screen HMI simplifies recipe editing, parameter setup, real‑time defect preview and quality‑data review. Side‑mounted multi‑color tower light clearly indicates running, warning and fault conditions for on‑site operators. Adjustable multi‑angle lighting delivers stable imaging for complex through‑hole solder joints. Typical detectable defects include solder bridging, cold solder, insufficient solder, excessive solder, missing pins, pin offset, component mis‑insertion, polarity reversal and foreign‑object contamination. It supports standard conveyor interface for inline docking with wave‑soldering production lines. Defect marking, alarm output and statistical reporting functions are available. Fast‑learning recipe programming shortens product change‑over time. Widely used for power‑supply boards, household‑appliance control boards, automotive through‑hole assemblies and industrial controller PCBA, replacing labor‑intensive manual visual inspection and improving production yield.
Features
- AI intelligent assisted programming
- Strong learning ability, supports continuous learning and improvement, getting better with more usage
- Trained on millions of samples, adapts to a wider range of scenarios with fewer false positives
- Powerful character recognition function, effectively identifies all types of characters
- Top shot, bottom shot, and upper & lower double shot can be flexibly selected to adapt to various scenarios
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