SMT DIP Post-wave AOI inspection Bottom View SPL-DI510

Product Introduction:

This SPL‑DI510 is a cost‑effective inline bottom‑view AOI developed by SIMBEL for DIP post‑wave‑soldering applications. Optimized for bottom‑side solder joint inspection, the system adopts high‑resolution bottom‑mount camera and multi‑angle programmable lighting to capture clear images of through‑hole solder joints. It focuses on typical solder‑joint defects: solder bridging, cold solder, insufficient solder, excessive solder, missing pins, pin offset, pin‑hole leakage and poor tin formation. Built‑in touch‑screen HMI supports recipe creation, parameter adjustment, real‑time defect preview and quality‑data statistics. Side‑mounted multi‑color tower light displays running, warning and fault status. Standard conveyor interface enables seamless inline docking with wave‑soldering lines. When defects are detected, the machine triggers alarm and outputs defect coordinates for marking or repair station. Intuitive recipe programming lowers skill requirement for operators and shortens product change‑over time. This bottom‑view AOI is an economical alternative to dual‑view models, suitable for production mainly focusing on solder‑joint quality control. Widely deployed in power supply boards, household appliance control boards and general‑purpose industrial DIP‑PCBA mass‑production lines.