SMT 3D Intelligent AOI inspection SPL-SM511 series

Product Introduction:

This SPL‑SM511 series is 3D intelligent AOI inspection machine developed for high‑reliability SMT post‑reflow applications. Integrated high‑precision 3D profilometry sensor and multi‑angle 2D color imaging, it combines 3D height‑volume measurement with 2D feature recognition. Beyond conventional 2D AOI capabilities, the 3D system accurately measures solder volume, joint height, component coplanarity, warpage and pin height. Detectable defects include tombstoning, lifted component, insufficient/excessive solder, bridging, coplanarity violation, missing component, offset placement, polarity error and foreign object debris. Built‑in large touch‑screen HMI supports recipe programming, real‑time 2D/3D image preview, defect review and comprehensive quality‑data statistics. Top‑mounted multi‑color tower light intuitively indicates running, warning and fault status. Standard conveyor interface supports seamless inline integration into existing SMT production lines. AI‑assisted recipe learning greatly reduces new product programming time and shortens product change‑over cycle. Defect coordinate output, NG marking and MES data interconnection are supported. This 3D AOI is widely used for automotive electronics, medical devices, communication modules, power electronics and high‑end consumer PCBA manufacturing, improving defect‑capture rate compared with traditional 2D AOI and guaranteeing high‑reliability assembly quality.